{"title":"改进了包括天线罩效应在内的等边三角形微带贴片输入阻抗的CAD计算公式","authors":"M. Biswas, A. Mandal","doi":"10.1109/ELECTRO.2009.5441112","DOIUrl":null,"url":null,"abstract":"A very simple CAD formulae based on cavity model analysis is used to compute the input impedance of an Equilateral Triangular Microstrip Patch Antenna (ETMPA) for wide range of variations of superstrate parameters .The computed values are compared with theoretical and experimental values available in open literature. A simulation software (CFDTD) is also used to validate our model.","PeriodicalId":149384,"journal":{"name":"2009 International Conference on Emerging Trends in Electronic and Photonic Devices & Systems","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2009-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Improved CAD formulae to calculate the input impedance of an equilateral triangular microstrip patch including radome effect\",\"authors\":\"M. Biswas, A. Mandal\",\"doi\":\"10.1109/ELECTRO.2009.5441112\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A very simple CAD formulae based on cavity model analysis is used to compute the input impedance of an Equilateral Triangular Microstrip Patch Antenna (ETMPA) for wide range of variations of superstrate parameters .The computed values are compared with theoretical and experimental values available in open literature. A simulation software (CFDTD) is also used to validate our model.\",\"PeriodicalId\":149384,\"journal\":{\"name\":\"2009 International Conference on Emerging Trends in Electronic and Photonic Devices & Systems\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 International Conference on Emerging Trends in Electronic and Photonic Devices & Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ELECTRO.2009.5441112\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 International Conference on Emerging Trends in Electronic and Photonic Devices & Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ELECTRO.2009.5441112","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Improved CAD formulae to calculate the input impedance of an equilateral triangular microstrip patch including radome effect
A very simple CAD formulae based on cavity model analysis is used to compute the input impedance of an Equilateral Triangular Microstrip Patch Antenna (ETMPA) for wide range of variations of superstrate parameters .The computed values are compared with theoretical and experimental values available in open literature. A simulation software (CFDTD) is also used to validate our model.
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