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引用次数: 1

摘要

功耗正在成为处理器性能最重要的限制因素,与传统的路线图相比,增加逻辑与缓存晶体管的比例使情况变得更糟。此外,I/O带宽的5/spl倍/额外增长需要显著的额外功率,这就需要将高每引脚频率与低每Gbit/s功率相结合的信号技术。然而,将频率改进限制在每年仅20%,与历史增长率相比,情况会更好,特别是限制热点功率密度。然而,提高电力效率、电力输送和散热的挑战仍然很大。虽然主要是为了挑战EPEP社区;我的演讲还将涵盖在解决主要挑战方面取得的一些进展,并讨论一些可能有助于应对仍然存在的挑战的系统和包设计方法。
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Architecting interconnect
Power is becoming the most significant limiter of processor performance, and increasing the ratio of logic versus cache transistors, as compared to the traditional roadmap, makes the situation worse. Also, the 5/spl times/ additional increase in I/O bandwidth requires significant extra power, putting a premium on signaling techniques that combine high per pin frequencies with low power per Gbit/s: However, limiting frequency improvements - to only 20% per year makes the situation better compared to historical growth rates and especially limits hot spot power densities. Nevertheless, the challenge to improve power efficiency, power delivery, and heat removal remains significant. Though mostly intended as a challenge to the EPEP community; my talk will also cover some of the advances made on addressing the main challenges and discusses some approaches to system and package design that may-help meet the challenges that remain.
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Modeling of non-ideal planes in stripline structures Generation of passive macromodels from transient port responses Power distribution analysis methodology for a multi-gigabit I/O interface Enforcing passivity for rational function based macromodels of tabulated data Laminate package trends for high-speed system interconnects
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