N. Parihar, R. Southwick, M. Wang, J. Stathis, S. Mahapatra
{"title":"SiGe p- finet中VAF的NBTI时间动力学和T依赖性建模","authors":"N. Parihar, R. Southwick, M. Wang, J. Stathis, S. Mahapatra","doi":"10.1109/IEDM.2017.8268345","DOIUrl":null,"url":null,"abstract":"NBTI in Replacement Metal Gate (RMG) High-K Metal Gate (HKMG) SiGe p-FinFETs is modeled. Time kinetics for DC and AC stress and recovery, temperature (T) dependence of voltage acceleration factor (VAF), and impact of Ge% and N% are quantified. Benchmarking is done with Si p-FinFETs, and process (Ge%, N%) dependence is explained by TCAD and band structure calculations.","PeriodicalId":412333,"journal":{"name":"2017 IEEE International Electron Devices Meeting (IEDM)","volume":"100 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"16","resultStr":"{\"title\":\"Modeling of NBTI time kinetics and T dependence of VAF in SiGe p-FinFETs\",\"authors\":\"N. Parihar, R. Southwick, M. Wang, J. Stathis, S. Mahapatra\",\"doi\":\"10.1109/IEDM.2017.8268345\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"NBTI in Replacement Metal Gate (RMG) High-K Metal Gate (HKMG) SiGe p-FinFETs is modeled. Time kinetics for DC and AC stress and recovery, temperature (T) dependence of voltage acceleration factor (VAF), and impact of Ge% and N% are quantified. Benchmarking is done with Si p-FinFETs, and process (Ge%, N%) dependence is explained by TCAD and band structure calculations.\",\"PeriodicalId\":412333,\"journal\":{\"name\":\"2017 IEEE International Electron Devices Meeting (IEDM)\",\"volume\":\"100 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"16\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 IEEE International Electron Devices Meeting (IEDM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEDM.2017.8268345\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE International Electron Devices Meeting (IEDM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.2017.8268345","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Modeling of NBTI time kinetics and T dependence of VAF in SiGe p-FinFETs
NBTI in Replacement Metal Gate (RMG) High-K Metal Gate (HKMG) SiGe p-FinFETs is modeled. Time kinetics for DC and AC stress and recovery, temperature (T) dependence of voltage acceleration factor (VAF), and impact of Ge% and N% are quantified. Benchmarking is done with Si p-FinFETs, and process (Ge%, N%) dependence is explained by TCAD and band structure calculations.