3d异构集成电路

2013 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) Pub Date : 2013-10-01 DOI:10.1109/S3S.2013.6716514

C. Chen, D. Yost, B. Aull, C. Chen, P. Gouker, J. Knecht, B. Tyrrell, K. Warner, B. Wheeler, P. Wyatt, C. Keast, V. Suntharalingam

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引用次数: 2

摘要

展示一系列幻灯片，涵盖以下主题:粘合;三维集成电路工艺流程;平版印刷的要求;三层单光子激光雷达焦平面;奈奎斯特限制红外焦平面;CMOS技术和SWIR探测器。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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3D-enabled heterogeneous integrated circuits

Presents a collection of slides covering the following topics: bonding; 3D integrated circuit process flow; lithographic requirements; 3-tier single-photon laser-radar focal plane; Nyquist-limited IR focal planes; CMOS technology and SWIR detectors.

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2013 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)

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