A. Wirick, S. Ulrich, N. Pham, M. Cases, D. de Araujo
{"title":"DDR II内存子系统的设计和建模挑战","authors":"A. Wirick, S. Ulrich, N. Pham, M. Cases, D. de Araujo","doi":"10.1109/EPEP.2003.1250038","DOIUrl":null,"url":null,"abstract":"This paper describes the electrical packaging challenges, design issues, and design solutions for source-synchronous DDR II memory subsystems utilizing the double data rate (DDR) timing protocols. Major design and modeling issues are discussed, such as crosstalk, delay skew, impedance control and inter-symbol interference. The timing and jitter budgets, and the noise margin allocation for the various components of the optimization equations are discussed in conjunction with their associated design control techniques. A novel termination technique is discussed that allows for maximum memory capacity per channel at a given data rate.","PeriodicalId":254477,"journal":{"name":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Design and modeling challenges for DDR II memory subsystems\",\"authors\":\"A. Wirick, S. Ulrich, N. Pham, M. Cases, D. de Araujo\",\"doi\":\"10.1109/EPEP.2003.1250038\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes the electrical packaging challenges, design issues, and design solutions for source-synchronous DDR II memory subsystems utilizing the double data rate (DDR) timing protocols. Major design and modeling issues are discussed, such as crosstalk, delay skew, impedance control and inter-symbol interference. The timing and jitter budgets, and the noise margin allocation for the various components of the optimization equations are discussed in conjunction with their associated design control techniques. A novel termination technique is discussed that allows for maximum memory capacity per channel at a given data rate.\",\"PeriodicalId\":254477,\"journal\":{\"name\":\"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2003-12-08\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2003.1250038\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2003.1250038","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Design and modeling challenges for DDR II memory subsystems
This paper describes the electrical packaging challenges, design issues, and design solutions for source-synchronous DDR II memory subsystems utilizing the double data rate (DDR) timing protocols. Major design and modeling issues are discussed, such as crosstalk, delay skew, impedance control and inter-symbol interference. The timing and jitter budgets, and the noise margin allocation for the various components of the optimization equations are discussed in conjunction with their associated design control techniques. A novel termination technique is discussed that allows for maximum memory capacity per channel at a given data rate.