马赛克:掩模优化解决方案与过程窗口感知逆校正

Jhih-Rong Gao, Xiaoqing Xu, Bei Yu, D. Pan
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引用次数: 64

摘要

光学接近校正(OPC)被广泛用于提高纳米光刻的分辨率。然而,传统的基于规则和基于模型的OPCs在先进的技术节点上遇到了严重的困难。逆光刻技术(ILT)解决了成像系统的逆问题,成为OPC的一个很有前途的解决方案。本文同时考虑1)标称工艺条件下的设计目标优化和2)不同工艺转角下的工艺窗口最小化,并解决基于ILT的掩模优化问题。该方法在IBM为ICCAD 2013竞赛发布的32nm设计上进行了测试。我们的优化在MOSAIC_fast和MOSAIC_exact两种模式下实现,这两种模式分别比ICCAD 2013比赛的第一名获奖者高出7%和11%。
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MOSAIC: Mask optimizing solution with process window aware inverse correction
Optical Proximity Correction (OPC) has been widely adopted for resolution enhancement to achieve nanolithography. However, conventional rule-based and model-based OPCs encounter severe difficulties at advanced technology nodes. Inverse Lithography Technique (ILT) that solves the inverse problem of the imaging system becomes a promising solution for OPC. In this paper, we consider simultaneously 1) the design target optimization under nominal process condition and 2) process window minimization with different process corners, and solve the mask optimization problem based on ILT. The proposed method is tested on 32nm designs released by IBM for the ICCAD 2013 contest. Our optimization is implemented in two modes, MOSAIC_fast and MOSAIC_exact, which outperform the first place winner of the ICCAD 2013 contest by 7% and 11%, respectively.
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