J. Pak, Jonghyun Cho, Joohee Kim, Heegon Kim, Kiyeong Kim, Joungho Kim, Junho Lee, Kunwoo Park
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Wafer-level TSV connectivity test using ring oscillator scheme
This paper presents the wafer-lvel TSV connectivity test method using ring oscillator scheme by showing its good immunity to TSV and chip process variations, efficient use of a chip area, simplicity of the test circuitry design, and low cost from its application before expensive wafer thinning and stacking processes. The proposed method can detect a delamination failure between TSVs and back end lines on a single TSV processed wafer.
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