电路级热载流子可靠性仿真在存储器设计中的应用

P.M. Lee, T. Seo, K. Ise, A. Hiraishi, O. Nagashima, S. Yoshida
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引用次数: 3

摘要

我们已经将热载子电路级模拟应用于几千到超过12 K晶体管的整个电路,使用简单但准确的退化模型来验证实际存储产品的可靠性。以前发表的应用是小规模的(几十个晶体管或单个电路块)或用于实验目的。通过对整个电路进行模拟,不会因为只模拟某些电路块而错过退化最严重的区域。随着技术发展到深亚微米高时钟速率,根据实际产品的不同退化使得精确的全电路仿真成为早期设计过程的关键部分。
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Application of circuit-level hot-carrier reliability simulation to memory design
We have applied hot-carrier circuit-level simulation to entire circuits of a few thousand to over 12 K transistors using a simple but accurate degradation model for reliability verification of actual memory products. Previous published applications were small scale (few tens of transistors or individual circuit blocks) or for experimental purposes. By applying simulation to entire circuits, areas with worst degradation are not missed due to simulating only certain circuit blocks. Varying degradation depending upon actual products make accurate total-circuit simulation a crucial part of the early design process as technology advances into the deep sub-micron high clock rate regime.
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