新型Y5V 0603 0.1 /spl mu/F陶瓷片式电容

J. Day, S. Gupta
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引用次数: 0

摘要

改进的技术已经发展到制造0.1 /spl mu/F的0603尺寸表面贴装陶瓷芯片。研制了一种以钛酸钡为基材的新型介电材料,其温度特性为Y5V,可获得最大介电常数。这些部件具有优异的电气和机械可靠性,并且在波峰焊过程中坚固耐用。为了降低成本,通过添加兼容的低熔点玻璃熔块,将电介质设计为在1145/spl℃下燃烧,从而使用具有高银含量的低成本电极。为了提高每层电容,改进了制造工艺,以实现薄介电层和窄电极边距
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A new Y5V 0603 0.1 /spl mu/F ceramic chip capacitor
Improved technologies have been developed to manufacture 0.1 /spl mu/F surface mountable ceramic chips in the 0603 size. A new dielectric based on barium titanate was developed with a Y5V temperature characteristic to achieve maximum dielectric constant. These parts achieve excellent electrical and mechanical reliability and are robust in wave soldering processes. To minimize cost the dielectric was designed to fire at 1145/spl deg/C by adding compatible low melting glass frit in order to use low cost electrodes with a high percentage of silver. In order to increase the capacitance per layer improved manufacturing processes were developed to achieve thin dielectric layers and narrow electrode side margins.<>
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