片上互连线与底层正交金属网格的色散和共振

Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) Pub Date : 2003-12-08 DOI:10.1109/EPEP.2003.1250011

Pingshan Wang, E. Kan

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引用次数: 1

摘要

在/spl sim/ 10ghz以下，具有底层正交金属栅格的高速互连线的色散和信号传输速度显著降低。矩形贴片天线理论可以准确地预测在较高频率下的强共振。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Dispersion and resonance of on-chip interconnect lines with underlayer orthogonal metal grids

High-speed interconnect lines with underlayer orthogonal metal grids show significant decreases in dispersions and signal transmission velocities below /spl sim/10 GHz. Strong resonance occurs at higher frequencies, which can be accurately predicated by the rectangular patch antenna theory.

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Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)

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