基于源漏工程的多晶硅薄膜晶体管(TFT) SONOS存储单元研究

B. Tsui, Jui-Yao Lai
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引用次数: 2

摘要

对具有多种源漏结的多晶硅薄膜晶体管SONOS存储单元进行了全面研究。对于纯肖特基势垒结,源极/漏极和栅极之间的重叠是至关重要的。2nm的欠迭导致高隧穿阻力,从而导致编程效率低下。设计合适的修正肖特基势垒结可以在保持擦除和保留性能不变的情况下提高Fowler-Nordheim隧道编程速度。耐久性试验过程中的主要退化机制是界面态的产生和隧道层的退化。在提高隧道层的质量后,改进的肖特基势垒结将成为三维多晶硅存储器的一种有前途的选择。
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A study on poly-Si thin-film transistor (TFT) SONOS memory cells with source/drain engineering
Poly-Si thin-film transistor SONOS memory cells with various source/drain junctions are studied comprehensively. For pure Schottky-barrier junction, the overlap between source/drain and gate is critical. A 2-nm underlap results in high tunneling resistance and thus poor programming efficiency. Suitable designed modified-Schottky-barrier junction can improve programming speed by Fowler-Nordheim tunneling while keeping erase and retention performance unaltered. The main degradation mechanism during endurance test is attributed to interface state generation and tunneling layer degradation. After improving the quality of the tunneling layer, the modified Schottky barrier junction would be a promising choice for 3-dimentional poly-Si memory.
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