{"title":"大规模高频集成电路频域分层有限元分析的一种高效三维到二维化简技术","authors":"Feng Sheng, S. Chakravarty, D. Jiao","doi":"10.1109/EPEP.2007.4387185","DOIUrl":null,"url":null,"abstract":"This paper proposes an efficient technique for reducing a 3D layered system matrix to a 2D layered one in the framework of the frequency-domain layered finite element method. This technique is capable of solving the volume-unknown based matrix equation in linear complexity, and hence reducing the complexity of 3D-to-2D reduction from O(M3) to O(M2), with M being the number of top/bottom surface unknowns in a single layer. The numerical procedure is rigorous without making any approximation. The technique applies to any arbitrarily-shaped multilayer IC problem. Numerical and experimental results have demonstrated its accuracy and efficiency.","PeriodicalId":402571,"journal":{"name":"2007 IEEE Electrical Performance of Electronic Packaging","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"An Efficient 3D-to-2D Reduction Technique for Frequency-Domain Layered Finite Element Analysis of Large-Scale High-Frequency Integrated Circuits\",\"authors\":\"Feng Sheng, S. Chakravarty, D. Jiao\",\"doi\":\"10.1109/EPEP.2007.4387185\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper proposes an efficient technique for reducing a 3D layered system matrix to a 2D layered one in the framework of the frequency-domain layered finite element method. This technique is capable of solving the volume-unknown based matrix equation in linear complexity, and hence reducing the complexity of 3D-to-2D reduction from O(M3) to O(M2), with M being the number of top/bottom surface unknowns in a single layer. The numerical procedure is rigorous without making any approximation. The technique applies to any arbitrarily-shaped multilayer IC problem. Numerical and experimental results have demonstrated its accuracy and efficiency.\",\"PeriodicalId\":402571,\"journal\":{\"name\":\"2007 IEEE Electrical Performance of Electronic Packaging\",\"volume\":\"2 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-11-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 IEEE Electrical Performance of Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2007.4387185\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 IEEE Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2007.4387185","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
An Efficient 3D-to-2D Reduction Technique for Frequency-Domain Layered Finite Element Analysis of Large-Scale High-Frequency Integrated Circuits
This paper proposes an efficient technique for reducing a 3D layered system matrix to a 2D layered one in the framework of the frequency-domain layered finite element method. This technique is capable of solving the volume-unknown based matrix equation in linear complexity, and hence reducing the complexity of 3D-to-2D reduction from O(M3) to O(M2), with M being the number of top/bottom surface unknowns in a single layer. The numerical procedure is rigorous without making any approximation. The technique applies to any arbitrarily-shaped multilayer IC problem. Numerical and experimental results have demonstrated its accuracy and efficiency.