基于格林函数的电子电路参数热分析

M. Janicki, A. Napieralski
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引用次数: 0

摘要

热仿真是现代电子电路设计过程中不可缺少的一个阶段。本文旨在演示如何使用热方程的解析解以合理的精度对电子电路进行简单的参数热分析。热模型的解决方案是采用格林函数的方法,没有使用任何复杂和昂贵的数值求解。本文的热模拟研究了各种热模型参数对测试结构温度的影响。类似的分析可以在实际电子电路的设计过程中进行,以优化它们的散热
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Parametric Thermal Analyses Of Electronic Circuits With Green's Functions
Thermal simulations are an indispensable stage in the design process of modern electronic circuits. This paper is intended to demonstrate how simple parametric thermal analyses of electronic circuits can be performed with reasonable accuracy using an analytical solution of the heat equation. The thermal model solution is found employing the Green's function approach without the use of any sophisticated and expensive numerical solver. The presented thermal simulations investigate the influence of various thermal model parameters on the temperature of a test structure. Similar analyses can be performed during the design of real electronic circuits as to optimise them thermally
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