基于贴片式压电力传感器的物流物联网实时监控

C. Chuang, Wan-Ching Weng, W. Chang, Da-Huei Lee
{"title":"基于贴片式压电力传感器的物流物联网实时监控","authors":"C. Chuang, Wan-Ching Weng, W. Chang, Da-Huei Lee","doi":"10.1109/NEMS.2016.7758259","DOIUrl":null,"url":null,"abstract":"We propose the use of simple and low cost piezoelectric based patch type sensors that ensure safety of the package while also detecting damage during shipment. A tear off sensor located at the top of the package can identify if the package has been opened while an impact sensor located at the bottom can monitor the damage suffered. The sensors are connected to a low power prototype read out device with a microcontroller (MCU) unit to analyze the data and a radio frequency (RF) module to transfer the data wirelessly. It would be viable to have an on-vehicle telematics device for collecting and analyzing data from multiple packages wirelessly so that it can be uploaded to the cloud, thus allowing for real time monitoring during transport. This logistics management model would aid in improving the quality of services provided by the logistics company while also earning consumer credibility. Thus, we believe that these patch type force sensors can be realistically implemented in logistics in the near future.","PeriodicalId":150449,"journal":{"name":"2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","volume":"53 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Real-time monitoring via patch-type piezoelectric force sensors for Internet of Thing in logistics\",\"authors\":\"C. Chuang, Wan-Ching Weng, W. Chang, Da-Huei Lee\",\"doi\":\"10.1109/NEMS.2016.7758259\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We propose the use of simple and low cost piezoelectric based patch type sensors that ensure safety of the package while also detecting damage during shipment. A tear off sensor located at the top of the package can identify if the package has been opened while an impact sensor located at the bottom can monitor the damage suffered. The sensors are connected to a low power prototype read out device with a microcontroller (MCU) unit to analyze the data and a radio frequency (RF) module to transfer the data wirelessly. It would be viable to have an on-vehicle telematics device for collecting and analyzing data from multiple packages wirelessly so that it can be uploaded to the cloud, thus allowing for real time monitoring during transport. This logistics management model would aid in improving the quality of services provided by the logistics company while also earning consumer credibility. Thus, we believe that these patch type force sensors can be realistically implemented in logistics in the near future.\",\"PeriodicalId\":150449,\"journal\":{\"name\":\"2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)\",\"volume\":\"53 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-04-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/NEMS.2016.7758259\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/NEMS.2016.7758259","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

我们建议使用简单和低成本的基于压电的贴片式传感器,以确保包装的安全,同时也检测运输过程中的损坏。位于包装顶部的撕裂传感器可以识别包装是否被打开,而位于底部的冲击传感器可以监测所遭受的损坏。传感器连接到一个低功耗的原型读出设备,该设备带有一个微控制器(MCU)单元来分析数据,一个射频(RF)模块来无线传输数据。配备车载远程信息处理设备,以无线方式收集和分析多个包裹的数据,并将其上传到云端,从而实现运输过程中的实时监控,这是可行的。这种物流管理模式将有助于提高物流公司提供的服务质量,同时也赢得了消费者的信任。因此,我们相信这些贴片式力传感器可以在不久的将来在物流中实际应用。
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Real-time monitoring via patch-type piezoelectric force sensors for Internet of Thing in logistics
We propose the use of simple and low cost piezoelectric based patch type sensors that ensure safety of the package while also detecting damage during shipment. A tear off sensor located at the top of the package can identify if the package has been opened while an impact sensor located at the bottom can monitor the damage suffered. The sensors are connected to a low power prototype read out device with a microcontroller (MCU) unit to analyze the data and a radio frequency (RF) module to transfer the data wirelessly. It would be viable to have an on-vehicle telematics device for collecting and analyzing data from multiple packages wirelessly so that it can be uploaded to the cloud, thus allowing for real time monitoring during transport. This logistics management model would aid in improving the quality of services provided by the logistics company while also earning consumer credibility. Thus, we believe that these patch type force sensors can be realistically implemented in logistics in the near future.
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