用红外直流注入法寻找印刷电路板上的短路元件

Zhifeng Zhu, G. Morris
{"title":"用红外直流注入法寻找印刷电路板上的短路元件","authors":"Zhifeng Zhu, G. Morris","doi":"10.31399/asm.edfa.2021-1.p022","DOIUrl":null,"url":null,"abstract":"\n This article explains how to find shorted components on PCB assemblies using infrared-based direct current injection, a nondestructive method that has several advantages over magnetic microscopy and voltage drop measurement techniques. An application example involving a power board failure is also provided.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2021-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Finding Shorted Components on Printed Circuit Boards by Infrared-Based Direct Current Injection Method\",\"authors\":\"Zhifeng Zhu, G. Morris\",\"doi\":\"10.31399/asm.edfa.2021-1.p022\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n This article explains how to find shorted components on PCB assemblies using infrared-based direct current injection, a nondestructive method that has several advantages over magnetic microscopy and voltage drop measurement techniques. An application example involving a power board failure is also provided.\",\"PeriodicalId\":431761,\"journal\":{\"name\":\"EDFA Technical Articles\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-02-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"EDFA Technical Articles\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.31399/asm.edfa.2021-1.p022\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"EDFA Technical Articles","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.31399/asm.edfa.2021-1.p022","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

这篇文章解释了如何使用基于红外的直流注入来找到PCB组件上的短路组件,这是一种非破坏性的方法,比磁显微镜和电压降测量技术有几个优点。给出了电源板故障的应用实例。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Finding Shorted Components on Printed Circuit Boards by Infrared-Based Direct Current Injection Method
This article explains how to find shorted components on PCB assemblies using infrared-based direct current injection, a nondestructive method that has several advantages over magnetic microscopy and voltage drop measurement techniques. An application example involving a power board failure is also provided.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Processes for Thinning and Polishing Highly Warped Die to a Nearly Consistent Thickness: Part III Four-Dimensional Scanning Transmission Electron Microscopy: Part II, Crystal Orientation and Phase, Short and Medium Range Order, and Electromagnetic Fields The Electronics Resurgence Initiative 2.0 for U.S. Semiconductor Manufacturing Advanced Characterization of Materials Using Atom Probe Tomography Laser-Based Copper Deposition for Semiconductor Debug Applications
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1