最小化多层通孔结构中的位移回流电流

2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2012-10-01 DOI:10.1109/EPEPS.2012.6457878

A. Hardock, S. Muller, X. Duan, H. Bruns, C. Schuster

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引用次数: 2

摘要

提出了一种利用轮廓积分法快速计算回接地电流的方法。通过对位移电流的分析，导出了多层板中优化过孔的设计原则。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Minimizing displacement return currents in multilayer via structures

A fast approach for the calculation of ground via return currents using the contour integral method is presented. From the analysis of the displacement currents design rules for optimized vias in multilayered boards are derived.

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2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems

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