{"title":"可控折叠芯片连接(C4)-使能技术","authors":"K. DeHaven, J. Dietz","doi":"10.1109/ECTC.1994.367660","DOIUrl":null,"url":null,"abstract":"Much of the technical information presented herein has been published by either IBM or Motorola This paper provides a higher-level view of the benefits, considerations and leverage applications of the C4 and DCA technologies. A key to acceptance and use of a new or different technology is its application in successful products. Although C4 is not new and has-been utilized extensively by IBM, it is different to Motorola. DCA is a relatively new technology and, thus, has a shorter history. As a foundation, this paper discusses the key C4 and DCA technical features and describes some initial product applications at Motorola. This linkage shows the enabling characteristics of the C4 flip-chip technology. Finally, future trends and directions of C4 and DCA technologies are discussed.<<ETX>>","PeriodicalId":344532,"journal":{"name":"1994 Proceedings. 44th Electronic Components and Technology Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"64","resultStr":"{\"title\":\"Controlled collapse chip connection (C4)-an enabling technology\",\"authors\":\"K. DeHaven, J. Dietz\",\"doi\":\"10.1109/ECTC.1994.367660\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Much of the technical information presented herein has been published by either IBM or Motorola This paper provides a higher-level view of the benefits, considerations and leverage applications of the C4 and DCA technologies. A key to acceptance and use of a new or different technology is its application in successful products. Although C4 is not new and has-been utilized extensively by IBM, it is different to Motorola. DCA is a relatively new technology and, thus, has a shorter history. As a foundation, this paper discusses the key C4 and DCA technical features and describes some initial product applications at Motorola. This linkage shows the enabling characteristics of the C4 flip-chip technology. Finally, future trends and directions of C4 and DCA technologies are discussed.<<ETX>>\",\"PeriodicalId\":344532,\"journal\":{\"name\":\"1994 Proceedings. 44th Electronic Components and Technology Conference\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"64\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1994 Proceedings. 44th Electronic Components and Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1994.367660\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1994 Proceedings. 44th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1994.367660","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Much of the technical information presented herein has been published by either IBM or Motorola This paper provides a higher-level view of the benefits, considerations and leverage applications of the C4 and DCA technologies. A key to acceptance and use of a new or different technology is its application in successful products. Although C4 is not new and has-been utilized extensively by IBM, it is different to Motorola. DCA is a relatively new technology and, thus, has a shorter history. As a foundation, this paper discusses the key C4 and DCA technical features and describes some initial product applications at Motorola. This linkage shows the enabling characteristics of the C4 flip-chip technology. Finally, future trends and directions of C4 and DCA technologies are discussed.<>