M. Sakane, K. Yagi, Takamoto Itoh, M. Yamashita, H. Hokazono
{"title":"时效对SnBi钎料蠕变性能的影响","authors":"M. Sakane, K. Yagi, Takamoto Itoh, M. Yamashita, H. Hokazono","doi":"10.1109/EPTC.2014.7028312","DOIUrl":null,"url":null,"abstract":"This paper discusses the effects of additive elements and aging on creep properties of SnBi solder system. Creep tests were performed on unaged and aged SnBi, SnBiAg and SnBiAgCuNiGe solders at three temperatures and the effects of them on creep rupture lifetimes and creep strain rates were discussed. The additive elements decreased creep strain rates and elongated creep rupture lifetimes. Causes of the effects were discussed from EBSD observations. The additive elements reduced the grain size and the aging coarsened grain size. The grain size had a pronounced effect on the creep strain rates and rupture lifetimes.","PeriodicalId":115713,"journal":{"name":"2014 IEEE 16th Electronics Packaging Technology Conference (EPTC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Aging effect on creep properties of SnBi solders\",\"authors\":\"M. Sakane, K. Yagi, Takamoto Itoh, M. Yamashita, H. Hokazono\",\"doi\":\"10.1109/EPTC.2014.7028312\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper discusses the effects of additive elements and aging on creep properties of SnBi solder system. Creep tests were performed on unaged and aged SnBi, SnBiAg and SnBiAgCuNiGe solders at three temperatures and the effects of them on creep rupture lifetimes and creep strain rates were discussed. The additive elements decreased creep strain rates and elongated creep rupture lifetimes. Causes of the effects were discussed from EBSD observations. The additive elements reduced the grain size and the aging coarsened grain size. The grain size had a pronounced effect on the creep strain rates and rupture lifetimes.\",\"PeriodicalId\":115713,\"journal\":{\"name\":\"2014 IEEE 16th Electronics Packaging Technology Conference (EPTC)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2014 IEEE 16th Electronics Packaging Technology Conference (EPTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC.2014.7028312\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 IEEE 16th Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2014.7028312","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper discusses the effects of additive elements and aging on creep properties of SnBi solder system. Creep tests were performed on unaged and aged SnBi, SnBiAg and SnBiAgCuNiGe solders at three temperatures and the effects of them on creep rupture lifetimes and creep strain rates were discussed. The additive elements decreased creep strain rates and elongated creep rupture lifetimes. Causes of the effects were discussed from EBSD observations. The additive elements reduced the grain size and the aging coarsened grain size. The grain size had a pronounced effect on the creep strain rates and rupture lifetimes.
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