{"title":"笔记本电脑单侧驱动压电微泵与冷板组合的研制","authors":"H.K. Ma, B. Hou, J.J. Gao, C. Lin, M. Kou","doi":"10.1109/STHERM.2008.4509378","DOIUrl":null,"url":null,"abstract":"We investigated a new one-sided actuating piezoelectric micropump combined with a cold plate (OAPCP-micropump) in a liquid cooling system to solve heat dissipation problems and to improve electronic device reliability for a laptop. The OAPCP-micropump, which is composed of a PDMS diaphragm, a 45 mm times 28 mmtimes 4 mm pump chamber with added fins, a rectangular piezoelectric device, and two check valves, can allow a thinner design and drive liquid in one direction. The results show that the shape of the fins has a strong effect on the pressure drops and flow profiles. The fluid in the pump chamber may impinge on the fins and increase the heat dissipation rate due to the oscillation by the actuator. When the fins are shorter than 1.25 mm, they have a negligible effect on the performance of the OAPCP-micropump. In addition, increasing the number of fins from 6 to 12 can enhance the heat dissipation rate but has no influence on the flow rate. The measured maximum flow rate of the OAPCP-micropump is 4.1 ml/s, and its maximum pump head reaches 9807 Pa. In general, the new cooling system with an OAPCP-micropump design shows a stable performance on total thermal resistance due to the high flow rate.","PeriodicalId":285718,"journal":{"name":"2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium","volume":"20 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-03-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Development of One-sided Actuating Piezoelectric Micropump Combined with Cold Plate in a Laptop\",\"authors\":\"H.K. Ma, B. Hou, J.J. Gao, C. Lin, M. Kou\",\"doi\":\"10.1109/STHERM.2008.4509378\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We investigated a new one-sided actuating piezoelectric micropump combined with a cold plate (OAPCP-micropump) in a liquid cooling system to solve heat dissipation problems and to improve electronic device reliability for a laptop. The OAPCP-micropump, which is composed of a PDMS diaphragm, a 45 mm times 28 mmtimes 4 mm pump chamber with added fins, a rectangular piezoelectric device, and two check valves, can allow a thinner design and drive liquid in one direction. The results show that the shape of the fins has a strong effect on the pressure drops and flow profiles. The fluid in the pump chamber may impinge on the fins and increase the heat dissipation rate due to the oscillation by the actuator. When the fins are shorter than 1.25 mm, they have a negligible effect on the performance of the OAPCP-micropump. In addition, increasing the number of fins from 6 to 12 can enhance the heat dissipation rate but has no influence on the flow rate. The measured maximum flow rate of the OAPCP-micropump is 4.1 ml/s, and its maximum pump head reaches 9807 Pa. In general, the new cooling system with an OAPCP-micropump design shows a stable performance on total thermal resistance due to the high flow rate.\",\"PeriodicalId\":285718,\"journal\":{\"name\":\"2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium\",\"volume\":\"20 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-03-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/STHERM.2008.4509378\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.2008.4509378","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7
摘要
为了解决笔记本电脑的散热问题和提高电子设备的可靠性,我们研究了一种新型的单侧驱动压电微泵与冷板(oapcp -微泵)相结合的液体冷却系统。oapcp微型泵由一个PDMS隔膜、一个45 mm × 28 mm × 4 mm的泵腔(带附加鳍)、一个矩形压电装置和两个止回阀组成,可以实现更薄的设计,并在一个方向上驱动液体。结果表明,翅片的形状对压降和流型有较大的影响。由于致动器的振荡,泵腔内的流体可能冲击鳍片,增加散热率。当翅片长度小于1.25 mm时,对oapcp -微泵性能的影响可以忽略不计。另外,将翅片数量从6片增加到12片可以提高散热率,但对流量没有影响。oapcp -微泵的实测最大流量为4.1 ml/s,最大泵扬程达到9807 Pa。总体而言,采用oapcp -微泵设计的新型冷却系统由于流量大,总热阻性能稳定。
Development of One-sided Actuating Piezoelectric Micropump Combined with Cold Plate in a Laptop
We investigated a new one-sided actuating piezoelectric micropump combined with a cold plate (OAPCP-micropump) in a liquid cooling system to solve heat dissipation problems and to improve electronic device reliability for a laptop. The OAPCP-micropump, which is composed of a PDMS diaphragm, a 45 mm times 28 mmtimes 4 mm pump chamber with added fins, a rectangular piezoelectric device, and two check valves, can allow a thinner design and drive liquid in one direction. The results show that the shape of the fins has a strong effect on the pressure drops and flow profiles. The fluid in the pump chamber may impinge on the fins and increase the heat dissipation rate due to the oscillation by the actuator. When the fins are shorter than 1.25 mm, they have a negligible effect on the performance of the OAPCP-micropump. In addition, increasing the number of fins from 6 to 12 can enhance the heat dissipation rate but has no influence on the flow rate. The measured maximum flow rate of the OAPCP-micropump is 4.1 ml/s, and its maximum pump head reaches 9807 Pa. In general, the new cooling system with an OAPCP-micropump design shows a stable performance on total thermal resistance due to the high flow rate.