系统级封装(SiP)中电感耦合建模的圆柱传导模式基函数

2007 IEEE Electrical Performance of Electronic Packaging Pub Date : 2007-11-21 DOI:10.1109/EPEP.2007.4387203

K. Han, E. Engin, M. Swaminathan

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引用次数: 6

摘要

提出了一种基于柱坐标全局基函数的PEEC方法，用于系统级封装中键合线的高效建模。与传统的PEEC方法相比，几个基函数的组合可以准确地描述靠近导线的高频效应，并且模拟时间更短。该方法简化的等效电路也有利于大型耦合结构的建模。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Cylindrical Conduction Mode Basis Functions for Modeling of Inductive Couplings in System-in-Package (SiP)

PEEC method with global basis functions on the cylindrical coordinates is presented for efficient modeling of bond wires in system-in-package. Combination of a few basis functions accurately describes high-frequency effects of closely located wires with shorter simulation time compared to the conventional PEEC method. Simplified equivalent circuit from the proposed method is also favorable for modeling of large coupling structures.

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2007 IEEE Electrical Performance of Electronic Packaging

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