{"title":"电子设计的统一CAD系统","authors":"J. C. Foster","doi":"10.1109/DAC.1984.1585820","DOIUrl":null,"url":null,"abstract":"We will describe a CAD system used by AT$#x0026;T Bell Laboratories, AT$#x0026;T Information Systems, and AT$#x0026;T Technologies, Inc. for the design and documentation of electronic packages. It is a highly integrated system designed around a single common data base. Both the system and data base have evolved over a number of years. The system is made up of two major functional subsystems; EDS - the Engineering Design System, a systems for design intent capture, validation and prototype for all packaging levels; IDS - the Interconnection Design System, a physical layout and documentation system for circuit packs and backplanes. In this paper we will take a high level view of the system, looking at the goals for the system and the consequent functional and architectural strategies, the history of its development, its overall architecture and some of the future directions its development might go in. Companion papers will discuss in more detail the functional components of the system plus some specifics of its use.","PeriodicalId":188431,"journal":{"name":"21st Design Automation Conference Proceedings","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1984-06-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"A Unified CAD System for Electronic Design\",\"authors\":\"J. C. Foster\",\"doi\":\"10.1109/DAC.1984.1585820\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We will describe a CAD system used by AT$#x0026;T Bell Laboratories, AT$#x0026;T Information Systems, and AT$#x0026;T Technologies, Inc. for the design and documentation of electronic packages. It is a highly integrated system designed around a single common data base. Both the system and data base have evolved over a number of years. The system is made up of two major functional subsystems; EDS - the Engineering Design System, a systems for design intent capture, validation and prototype for all packaging levels; IDS - the Interconnection Design System, a physical layout and documentation system for circuit packs and backplanes. In this paper we will take a high level view of the system, looking at the goals for the system and the consequent functional and architectural strategies, the history of its development, its overall architecture and some of the future directions its development might go in. Companion papers will discuss in more detail the functional components of the system plus some specifics of its use.\",\"PeriodicalId\":188431,\"journal\":{\"name\":\"21st Design Automation Conference Proceedings\",\"volume\":\"18 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1984-06-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"21st Design Automation Conference Proceedings\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/DAC.1984.1585820\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"21st Design Automation Conference Proceedings","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DAC.1984.1585820","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
摘要
我们将描述AT$#x0026;T Bell实验室、AT$#x0026;T Information Systems和AT$#x0026;T Technologies, Inc.用于电子封装设计和文档编制的CAD系统。它是一个围绕单一公共数据库设计的高度集成的系统。系统和数据库都经过了多年的发展。该系统由两大功能子系统组成;EDS—工程设计系统,用于所有包装级别的设计意图捕获、验证和原型的系统;IDS -互连设计系统,电路包和背板的物理布局和文档系统。在本文中,我们将从一个高层次的角度来看待这个系统,看看系统的目标和相应的功能和架构策略,它的发展历史,它的整体架构和一些未来的发展方向。配套的论文将更详细地讨论系统的功能组件及其使用的一些细节。
We will describe a CAD system used by AT$#x0026;T Bell Laboratories, AT$#x0026;T Information Systems, and AT$#x0026;T Technologies, Inc. for the design and documentation of electronic packages. It is a highly integrated system designed around a single common data base. Both the system and data base have evolved over a number of years. The system is made up of two major functional subsystems; EDS - the Engineering Design System, a systems for design intent capture, validation and prototype for all packaging levels; IDS - the Interconnection Design System, a physical layout and documentation system for circuit packs and backplanes. In this paper we will take a high level view of the system, looking at the goals for the system and the consequent functional and architectural strategies, the history of its development, its overall architecture and some of the future directions its development might go in. Companion papers will discuss in more detail the functional components of the system plus some specifics of its use.