T.-Y. Kondo, S. Kitamura, Y. Nimura, T. Kaneko, T. Shimoda
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Thin film VCSEL assembly on CMOS IC using ELO and nano paste metallization
In this work, we present the enhancement of previous work by monolithically appearance assembly using nano paste metallization on IC with Au plated pads and higher frequency operation. We have demonstrated the assembly of thin film VCSEL on CMOS laser driver IC in monolithically dimension. ELO (epitaxial liftoff) technique, polyimide bonding and nano paste metallization with Au plated pads were used for this work. The modulation of light output from thin film VCSEL at 2.5 Gbps was achieved.
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