{"title":"基于KPCA和随机森林的钢丝键合接头特征分类","authors":"Zhili Long, Xing Zhou, Xiaobing Zhang, Yuyang Yuan","doi":"10.1109/EPTC.2018.8654408","DOIUrl":null,"url":null,"abstract":"We present a feasible algorithm to automatic identify and classify the quality of bonding joint in wire bonding via machine learning, named as KPCA (Kernel Principal Analysis) and Random Forest. The result can be acceptable in calculation time and accuracy, which is possible to use as Feedback to control bonding parameters such as ultrasonic power and pressure, to strength the bonding reliability in production. First, the bonding joint images are mapped to a high dimension space, where KPCA is applied to decrease the image dimension for less calculation consumption and to eliminate high correlation features. The joint defect are then automatically identified and classified by Random Forest algorithm. Several strategies are adopted for improvement of accuracy. Our experiment result shows that the joint classification based on KPCA and Random Forest algorithm are better than conventional SVM and CNN algorithm on efficiency and accuracy.","PeriodicalId":360239,"journal":{"name":"2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)","volume":"83 7","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Joint Feature Classification for Wire Bond Joint Based on KPCA and Random Forest\",\"authors\":\"Zhili Long, Xing Zhou, Xiaobing Zhang, Yuyang Yuan\",\"doi\":\"10.1109/EPTC.2018.8654408\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We present a feasible algorithm to automatic identify and classify the quality of bonding joint in wire bonding via machine learning, named as KPCA (Kernel Principal Analysis) and Random Forest. The result can be acceptable in calculation time and accuracy, which is possible to use as Feedback to control bonding parameters such as ultrasonic power and pressure, to strength the bonding reliability in production. First, the bonding joint images are mapped to a high dimension space, where KPCA is applied to decrease the image dimension for less calculation consumption and to eliminate high correlation features. The joint defect are then automatically identified and classified by Random Forest algorithm. Several strategies are adopted for improvement of accuracy. Our experiment result shows that the joint classification based on KPCA and Random Forest algorithm are better than conventional SVM and CNN algorithm on efficiency and accuracy.\",\"PeriodicalId\":360239,\"journal\":{\"name\":\"2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)\",\"volume\":\"83 7\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC.2018.8654408\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2018.8654408","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
摘要
本文提出了一种基于机器学习的自动识别和分类焊丝焊接接头质量的可行算法,称为KPCA (Kernel Principal Analysis)和随机森林。结果在计算时间和精度上均可接受,可作为反馈控制超声功率、压力等键合参数,提高生产中键合的可靠性。首先,将连接节点图像映射到高维空间,在高维空间中应用KPCA降低图像维数以减少计算量并消除高相关特征。然后采用随机森林算法对接头缺陷进行自动识别和分类。采用了几种策略来提高精度。实验结果表明,基于KPCA和随机森林算法的联合分类在效率和准确率上都优于传统的SVM和CNN算法。
Joint Feature Classification for Wire Bond Joint Based on KPCA and Random Forest
We present a feasible algorithm to automatic identify and classify the quality of bonding joint in wire bonding via machine learning, named as KPCA (Kernel Principal Analysis) and Random Forest. The result can be acceptable in calculation time and accuracy, which is possible to use as Feedback to control bonding parameters such as ultrasonic power and pressure, to strength the bonding reliability in production. First, the bonding joint images are mapped to a high dimension space, where KPCA is applied to decrease the image dimension for less calculation consumption and to eliminate high correlation features. The joint defect are then automatically identified and classified by Random Forest algorithm. Several strategies are adopted for improvement of accuracy. Our experiment result shows that the joint classification based on KPCA and Random Forest algorithm are better than conventional SVM and CNN algorithm on efficiency and accuracy.