{"title":"电力电子应用热界面老化研究","authors":"J. Ousten, Zoubir Khatir, Ludovic Menager","doi":"10.1109/STHERM.2011.5767171","DOIUrl":null,"url":null,"abstract":"This paper presents new investigations on the aging of Thermal Interface Materials (TIM) subjected to thermal cycling conditions. The challenge was to design a specific and original set-up in order to not only undergo avionic temperature mission profile (-50°C/150°C) but also to perform standardized thermal characterization at always same conditions. Thermal conductivity is used as aging indicator. Several TIM materials (change phase, graphite and polymer based) have undergone more than 850 of such cycles. As a result, only the phase change material thermal interface has been affected with a 30% decrease of initial thermal resistance.","PeriodicalId":128077,"journal":{"name":"2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Study of thermal interfaces aging for power electronics applications\",\"authors\":\"J. Ousten, Zoubir Khatir, Ludovic Menager\",\"doi\":\"10.1109/STHERM.2011.5767171\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents new investigations on the aging of Thermal Interface Materials (TIM) subjected to thermal cycling conditions. The challenge was to design a specific and original set-up in order to not only undergo avionic temperature mission profile (-50°C/150°C) but also to perform standardized thermal characterization at always same conditions. Thermal conductivity is used as aging indicator. Several TIM materials (change phase, graphite and polymer based) have undergone more than 850 of such cycles. As a result, only the phase change material thermal interface has been affected with a 30% decrease of initial thermal resistance.\",\"PeriodicalId\":128077,\"journal\":{\"name\":\"2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium\",\"volume\":\"16 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-03-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/STHERM.2011.5767171\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.2011.5767171","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Study of thermal interfaces aging for power electronics applications
This paper presents new investigations on the aging of Thermal Interface Materials (TIM) subjected to thermal cycling conditions. The challenge was to design a specific and original set-up in order to not only undergo avionic temperature mission profile (-50°C/150°C) but also to perform standardized thermal characterization at always same conditions. Thermal conductivity is used as aging indicator. Several TIM materials (change phase, graphite and polymer based) have undergone more than 850 of such cycles. As a result, only the phase change material thermal interface has been affected with a 30% decrease of initial thermal resistance.
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