{"title":"纳米级晶体管纵向和横向集成IMOS和TFET器件的可行性研究","authors":"P. Divya, I. Saad","doi":"10.1109/SMELEC.2010.5549575","DOIUrl":null,"url":null,"abstract":"A review on the integration of vertical impact ionization MOSFET (IMOS) with vertical tunnelling FET (TFET) has been presented in this paper. A comparison has been done on the lateral and vertical I-MOS and TFET device structures, highlighting the advantages and drawbacks of each device. Integration of I-MOS and TFET on a vertical scale is seen as one of the promising solutions, to continue the trend of scaling down the devices further, in the nanometer regime.","PeriodicalId":308501,"journal":{"name":"2010 IEEE International Conference on Semiconductor Electronics (ICSE2010)","volume":"107 12","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-06-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Feasibility study of integrated vertical and lateral IMOS and TFET devices for nano-scale transistors\",\"authors\":\"P. Divya, I. Saad\",\"doi\":\"10.1109/SMELEC.2010.5549575\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A review on the integration of vertical impact ionization MOSFET (IMOS) with vertical tunnelling FET (TFET) has been presented in this paper. A comparison has been done on the lateral and vertical I-MOS and TFET device structures, highlighting the advantages and drawbacks of each device. Integration of I-MOS and TFET on a vertical scale is seen as one of the promising solutions, to continue the trend of scaling down the devices further, in the nanometer regime.\",\"PeriodicalId\":308501,\"journal\":{\"name\":\"2010 IEEE International Conference on Semiconductor Electronics (ICSE2010)\",\"volume\":\"107 12\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-06-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 IEEE International Conference on Semiconductor Electronics (ICSE2010)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SMELEC.2010.5549575\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 IEEE International Conference on Semiconductor Electronics (ICSE2010)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SMELEC.2010.5549575","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Feasibility study of integrated vertical and lateral IMOS and TFET devices for nano-scale transistors
A review on the integration of vertical impact ionization MOSFET (IMOS) with vertical tunnelling FET (TFET) has been presented in this paper. A comparison has been done on the lateral and vertical I-MOS and TFET device structures, highlighting the advantages and drawbacks of each device. Integration of I-MOS and TFET on a vertical scale is seen as one of the promising solutions, to continue the trend of scaling down the devices further, in the nanometer regime.