{"title":"设计技术挑战系统和芯片级设计在非常深的亚微米技术","authors":"James Lin","doi":"10.1145/944645.944695","DOIUrl":null,"url":null,"abstract":"With very deep submicron process technologies, previously ignorable phenomena now have great impact on the robustness of IC designs. At the same time, the smaller feature sizes also enable an exponential increase in number of functions (or transistor count) available on chip. Complexity in process technology and design is widening the Design Technology gap, which, if not addressed properly, will threaten the continuation of process scaling and the industry's ability to benefit from it. The complexity of process and design technology, its impact on new designs, new products development and future solutions will be discussed in this presentation.","PeriodicalId":174422,"journal":{"name":"First IEEE/ACM/IFIP International Conference on Hardware/ Software Codesign and Systems Synthesis (IEEE Cat. No.03TH8721)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Design technology challenges for system and chip level designs in very deep submicron technologies\",\"authors\":\"James Lin\",\"doi\":\"10.1145/944645.944695\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"With very deep submicron process technologies, previously ignorable phenomena now have great impact on the robustness of IC designs. At the same time, the smaller feature sizes also enable an exponential increase in number of functions (or transistor count) available on chip. Complexity in process technology and design is widening the Design Technology gap, which, if not addressed properly, will threaten the continuation of process scaling and the industry's ability to benefit from it. The complexity of process and design technology, its impact on new designs, new products development and future solutions will be discussed in this presentation.\",\"PeriodicalId\":174422,\"journal\":{\"name\":\"First IEEE/ACM/IFIP International Conference on Hardware/ Software Codesign and Systems Synthesis (IEEE Cat. No.03TH8721)\",\"volume\":\"24 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2003-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"First IEEE/ACM/IFIP International Conference on Hardware/ Software Codesign and Systems Synthesis (IEEE Cat. No.03TH8721)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1145/944645.944695\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"First IEEE/ACM/IFIP International Conference on Hardware/ Software Codesign and Systems Synthesis (IEEE Cat. No.03TH8721)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/944645.944695","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Design technology challenges for system and chip level designs in very deep submicron technologies
With very deep submicron process technologies, previously ignorable phenomena now have great impact on the robustness of IC designs. At the same time, the smaller feature sizes also enable an exponential increase in number of functions (or transistor count) available on chip. Complexity in process technology and design is widening the Design Technology gap, which, if not addressed properly, will threaten the continuation of process scaling and the industry's ability to benefit from it. The complexity of process and design technology, its impact on new designs, new products development and future solutions will be discussed in this presentation.