{"title":"铜再沉积QFN表面变色失效分析","authors":"S. Buenviaje","doi":"10.1109/EPTC56328.2022.10013191","DOIUrl":null,"url":null,"abstract":"Tapeless technology of QFN-mr has been a breakthrough in back-end manufacturing. However, back-etching process has some tradeoffs. Surface discoloration at this station has been a chronic defect. In this study, process simulations and material characterizations were performed to determine the root cause. Presence of copper and sulfur was correlated with the high concentration of sulfuric acid through a phenomenon called as copper redeposition.","PeriodicalId":163034,"journal":{"name":"2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-12-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Failure Analysis of QFN Surface Discoloration by Copper Redeposition\",\"authors\":\"S. Buenviaje\",\"doi\":\"10.1109/EPTC56328.2022.10013191\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Tapeless technology of QFN-mr has been a breakthrough in back-end manufacturing. However, back-etching process has some tradeoffs. Surface discoloration at this station has been a chronic defect. In this study, process simulations and material characterizations were performed to determine the root cause. Presence of copper and sulfur was correlated with the high concentration of sulfuric acid through a phenomenon called as copper redeposition.\",\"PeriodicalId\":163034,\"journal\":{\"name\":\"2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)\",\"volume\":\"16 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-12-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC56328.2022.10013191\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC56328.2022.10013191","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Failure Analysis of QFN Surface Discoloration by Copper Redeposition
Tapeless technology of QFN-mr has been a breakthrough in back-end manufacturing. However, back-etching process has some tradeoffs. Surface discoloration at this station has been a chronic defect. In this study, process simulations and material characterizations were performed to determine the root cause. Presence of copper and sulfur was correlated with the high concentration of sulfuric acid through a phenomenon called as copper redeposition.
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