功率密度、电路退化和可靠性的三角关系

J. Henkel, P. Montuschi
{"title":"功率密度、电路退化和可靠性的三角关系","authors":"J. Henkel, P. Montuschi","doi":"10.1109/MC.2017.214","DOIUrl":null,"url":null,"abstract":"Power density will stay a major challenge for the foreseeable future. Despite orders-of-magnitude-improved efficiency, power consumption per area is sharply rising, mainly due to the limits of voltage scaling. To investigate the physical implications of high power densities, we must distinguish between peak and average temperatures and temporal and spatial thermal gradients because they trigger circuit-aging mechanisms and eventually jeopardize the reliability of an on-chip system. The talk starts by presenting some basic interdependencies in the triangle of power density, circuit degradation and reliability and continues with some solutions to mitigate the problem via, among others, power density-aware resource management and efficient power budgeting.","PeriodicalId":366264,"journal":{"name":"2017 30th IEEE International System-on-Chip Conference (SOCC)","volume":"81 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The triangle of power density, circuit degradation and reliability\",\"authors\":\"J. Henkel, P. Montuschi\",\"doi\":\"10.1109/MC.2017.214\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Power density will stay a major challenge for the foreseeable future. Despite orders-of-magnitude-improved efficiency, power consumption per area is sharply rising, mainly due to the limits of voltage scaling. To investigate the physical implications of high power densities, we must distinguish between peak and average temperatures and temporal and spatial thermal gradients because they trigger circuit-aging mechanisms and eventually jeopardize the reliability of an on-chip system. The talk starts by presenting some basic interdependencies in the triangle of power density, circuit degradation and reliability and continues with some solutions to mitigate the problem via, among others, power density-aware resource management and efficient power budgeting.\",\"PeriodicalId\":366264,\"journal\":{\"name\":\"2017 30th IEEE International System-on-Chip Conference (SOCC)\",\"volume\":\"81 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 30th IEEE International System-on-Chip Conference (SOCC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MC.2017.214\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 30th IEEE International System-on-Chip Conference (SOCC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MC.2017.214","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

在可预见的未来,功率密度仍将是一个主要挑战。尽管效率有了数量级的提高,但单位面积的功耗却急剧上升,这主要是由于电压缩放的限制。为了研究高功率密度的物理影响,我们必须区分峰值和平均温度以及时间和空间热梯度,因为它们会触发电路老化机制,并最终危及片上系统的可靠性。讲座首先介绍了功率密度、电路退化和可靠性三角关系中的一些基本相互依赖关系,并继续介绍了通过功率密度感知资源管理和有效的功率预算来缓解问题的一些解决方案。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
The triangle of power density, circuit degradation and reliability
Power density will stay a major challenge for the foreseeable future. Despite orders-of-magnitude-improved efficiency, power consumption per area is sharply rising, mainly due to the limits of voltage scaling. To investigate the physical implications of high power densities, we must distinguish between peak and average temperatures and temporal and spatial thermal gradients because they trigger circuit-aging mechanisms and eventually jeopardize the reliability of an on-chip system. The talk starts by presenting some basic interdependencies in the triangle of power density, circuit degradation and reliability and continues with some solutions to mitigate the problem via, among others, power density-aware resource management and efficient power budgeting.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Content-aware line-based power modeling methodology for image signal processor Power and area evaluation of a fault-tolerant network-on-chip A low-pass continuous-time delta-sigma interface circuit for wideband MEMS gyroscope readout ASIC Lithography hotspot detection: From shallow to deep learning The path to global connectivity — Wireless communication enters the next generation
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1