大功率稳定场镀gan - gan moshfet

V. Adivarahan, A. Koudymov, S. Rai, J. Yang, G. Simin, M. Asif Khan, Q. Fareed, R. Gaska
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引用次数: 0

摘要

我们描述了新颖的AlGaN-GaN金属氧化物半导体异质结构场效应晶体管(moshfet),具有创纪录的高功率电压效率(PVE = RF功率/漏极偏置),在2 GHz时高达0.43W/V-mm。实验测量了35 V时15 W/mm (PVE=0.43 W/V-mm)和55 V时20 W/mm (PVE= 0.36W/V-mm)的射频功率,比之前报道的PVE=0.25 W/V-mm (120 V时30 W/mm)的值高出约50%。在接近20 W/mm的功率水平下,MOSHFET器件表现出非常稳定的工作时间超过120小时。这也是III-N微波场效应管器件在如此高功率水平下的稳定性的首次演示。我们的新器件设计的主要特点是:(i)在泄漏的介电层上使用去除捕获电荷的场板进行电流无坍缩操作;(ii)选择性区域掺杂,以实现创纪录的低接入电阻;(iii)绝缘栅极设计,抑制导致器件退化的正向栅极电流。在本文中,我们将提供详细的实验证据来支持我们对III-N场效应管首次实现创纪录rf性能的解释
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High-power stable field-plated AlGaN-GaN MOSHFETs
We describe novel AlGaN-GaN metal-oxide-semiconductor heterostructure field-effect transistors (MOSHFETs) with record high power-voltage efficiencies (PVE = RF power/Drain bias), up to 0.43W/V-mm at 2 GHz. The RF powers of 15 W/mm at 35 V (PVE=0.43 W/V-mm) and 20 W/mm at 55 V (PVE= 0.36W/V-mm) were measured, which are approximately 50% higher than the previously reported values of PVE=0.25 W/V-mm (30 W/mm at 120 V). The MOSHFET devices exhibit an extremely stable operation for times in excess of 120 hours at power levels close to 20 W/mm. This is also the first demonstration of stability for a III-N microwave FET device at such a high power level. The key features of our new device design are (i) current collapse-free operation using trapped charge removing field-plates over leaky dielectric layers; (ii) selective area doping to achieve record low access resistances and (iii) an insulated gate design suppressing forward gate currents responsible for device degradation. In the paper we will present detailed experimental evidence to support our explanations for achieving the record RF-performance for the III-N FETs for the first time
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High-power stable field-plated AlGaN-GaN MOSHFETs A new four-terminal hybrid silicon/organic field-effect sensor device Tunnel junctions in GaN/AlN for optoelectronic applications Data retention behavior in the embedded SONOS nonvolatile memory cell Mobility and sub-threshold characteristics in high-mobility dual-channel strained Si/strainef SiGe p-MOSFETs
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