{"title":"表面安装中双组分焊接的新方法","authors":"V. Videkov, V. Tsenev","doi":"10.1109/ET.2019.8878489","DOIUrl":null,"url":null,"abstract":"The report presents experimental results from the development of a new method of soldering of surface mount components. Various soldering pastes were used to form the solder. Footprinting is done by combining screen printing and dispenser, screen printing and Jet printer. Experimental combinations of high-temperature and low-temperature leadfree pastes were used. The footprints are located wholly or partially on contact pads using different topologies. The process is described and the soldering effects are presented.","PeriodicalId":306452,"journal":{"name":"2019 IEEE XXVIII International Scientific Conference Electronics (ET)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2019-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"New method for two-component soldering in surface mounting\",\"authors\":\"V. Videkov, V. Tsenev\",\"doi\":\"10.1109/ET.2019.8878489\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The report presents experimental results from the development of a new method of soldering of surface mount components. Various soldering pastes were used to form the solder. Footprinting is done by combining screen printing and dispenser, screen printing and Jet printer. Experimental combinations of high-temperature and low-temperature leadfree pastes were used. The footprints are located wholly or partially on contact pads using different topologies. The process is described and the soldering effects are presented.\",\"PeriodicalId\":306452,\"journal\":{\"name\":\"2019 IEEE XXVIII International Scientific Conference Electronics (ET)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 IEEE XXVIII International Scientific Conference Electronics (ET)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ET.2019.8878489\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE XXVIII International Scientific Conference Electronics (ET)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ET.2019.8878489","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
New method for two-component soldering in surface mounting
The report presents experimental results from the development of a new method of soldering of surface mount components. Various soldering pastes were used to form the solder. Footprinting is done by combining screen printing and dispenser, screen printing and Jet printer. Experimental combinations of high-temperature and low-temperature leadfree pastes were used. The footprints are located wholly or partially on contact pads using different topologies. The process is described and the soldering effects are presented.
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