选定半导体工艺的发射测定和消减设备的评价

R. Ridgeway
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引用次数: 0

摘要

仅给出摘要形式,如下。最近对半导体加工排放的关注要求开发分析方法,以量化未使用的工艺气体,表征和量化工艺副产品,并确定减排设备的有效性。排放有害空气污染物(HAPS)和全氟化合物(pfc)的工艺因涉嫌造成环境和健康相关问题而受到审查。本文描述了实时分析方法,该方法允许测定未消耗的工艺气体和工艺副产品,并评估减排效果。来自最先进的生产设施的数据展示了实时分析的有效性。对测量精度至关重要的校准方法也进行了讨论。执行过程和流出物监测的好处可能是多方面的,包括由于吞吐量增加、硬件使用寿命延长、洗涤器使用减少和原材料成本降低而降低的拥有成本。此外,法规遵从性问题可以从定量而不是定性的角度来处理。
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Determination of emissions and evaluation of abatement equipment for selected semiconductor processes
Summary form only given, as follows. Recent attention focusing on semiconductor processing emissions has required the development of analytical methodology for quantifying unused process gases, characterizing and quantifying process by-products, and determining the effectiveness of abatement equipment. Processes emitting Hazardous Air Pollutants (HAPS) and Perfluorinated Compounds (PFCs) have come under scrutiny because of their suspected contribution to environmental and health related problems. This paper described real-time analytical methodology which permits determination of unconsumed process gases and process by-products, and evaluation of abatement effectiveness. Data from state-of-the-art production facilities are presented to demonstrate the effectiveness of real-time analysis. Calibration methodology, which is critical for measurement accuracy, is also discussed. The benefits of performing process and effluent monitoring could be multifold, including cost-of-ownership reductions from increased throughput, increased hardware lifetime, scrubber use reduction, and decreased raw materials costs. Additionally, regulatory compliance issues can be dealt with from a quantitative rather than qualitative standpoint.
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