考虑非理想共地连接的差分信号多板PCB系统的电气分析

2007 IEEE Electrical Performance of Electronic Packaging Pub Date : 2007-11-21 DOI:10.1109/EPEP.2007.4387117

M. Mondal, B. Mutnury, P. Patel, S. Connor, B. Archambeault, M. Cases

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引用次数: 9

摘要

在多板系统中，电流返回路径不均匀会对高速差分信号产生显著的共模噪声。本文利用测量和建模结果描述了考虑板间连接器电感的共模噪声对电信号的影响。提出了一种有效而准确的共模噪声建模方法，以确保更好的设计实践。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Electrical Analysis of Multi-board PCB Systems with Differential Signaling Considering Non-ideal Common Ground Connection

Non-uniform current return path in multi-board systems induces significant common mode noise in high speed differential signals. The effect of the common mode noise on electrical signals considering inductance of inter-board connectors is described in this paper using measurement and modeling results. An effective and accurate method for modeling the common mode noise is proposed to ensure better design practices.

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2007 IEEE Electrical Performance of Electronic Packaging

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