A Broadband Flip-Chip Microwave Amplifier on a LTCC Substrate

In this paper, a flip-chip vertical interconnect transition structure is designed based on the existing integration process, and a 2GHz∼6GHz amplifier chip is integrated on LTCC circuit with leadless interconnection by using the flip-chip vertical interconnect transition structure. The integrated circuit is simulated, fabricated and measured, the simulated and measured results show a good match. It is a good reference for application of high density integration microwave microsystems.