S. Akhtar, G. Schuppener, T. Dinc, B. Haroun, S. Sankaran
{"title":"DC至12+GHz, +30dBm OIP3, 7.2dB噪声图有源Balun在130nm BiCMOS射频采样多gbps数据转换器","authors":"S. Akhtar, G. Schuppener, T. Dinc, B. Haroun, S. Sankaran","doi":"10.1109/RFIC54546.2022.9863207","DOIUrl":null,"url":null,"abstract":"An active balun using dual stage feedback and distributed feedforward distortion cancellation for use as a driver amplifier for wideband RF sampling ADCs is presented. With a gain of 16.5dB & HD2 of 60dBc while delivering 3dBm (100Ω), the DC coupled balun achieves a linear-bandwidth of >12GHz holding OIP3>27dBm & NF<8dB, and small-signal bandwidth of 18GHz with <±0.5dB amplitude & <±2.5° phase imbalance. Cascaded balun + ADC measurements demonstrate no linearity limitation, while allowing for 19.5dB lower input signal. Occupying 1mm2in a 130nm BiCMOS process, the device consumes 100mA from 5V in a 2×2mm2 flip chip QFN package.","PeriodicalId":415294,"journal":{"name":"2022 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)","volume":"266 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"DC to 12+GHz, +30dBm OIP3, 7.2dB Noise Figure Active Balun in 130nm BiCMOS for RF Sampling Multi-Gbps Data Converters\",\"authors\":\"S. Akhtar, G. Schuppener, T. Dinc, B. Haroun, S. Sankaran\",\"doi\":\"10.1109/RFIC54546.2022.9863207\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"An active balun using dual stage feedback and distributed feedforward distortion cancellation for use as a driver amplifier for wideband RF sampling ADCs is presented. With a gain of 16.5dB & HD2 of 60dBc while delivering 3dBm (100Ω), the DC coupled balun achieves a linear-bandwidth of >12GHz holding OIP3>27dBm & NF<8dB, and small-signal bandwidth of 18GHz with <±0.5dB amplitude & <±2.5° phase imbalance. Cascaded balun + ADC measurements demonstrate no linearity limitation, while allowing for 19.5dB lower input signal. Occupying 1mm2in a 130nm BiCMOS process, the device consumes 100mA from 5V in a 2×2mm2 flip chip QFN package.\",\"PeriodicalId\":415294,\"journal\":{\"name\":\"2022 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)\",\"volume\":\"266 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-06-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RFIC54546.2022.9863207\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RFIC54546.2022.9863207","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
DC to 12+GHz, +30dBm OIP3, 7.2dB Noise Figure Active Balun in 130nm BiCMOS for RF Sampling Multi-Gbps Data Converters
An active balun using dual stage feedback and distributed feedforward distortion cancellation for use as a driver amplifier for wideband RF sampling ADCs is presented. With a gain of 16.5dB & HD2 of 60dBc while delivering 3dBm (100Ω), the DC coupled balun achieves a linear-bandwidth of >12GHz holding OIP3>27dBm & NF<8dB, and small-signal bandwidth of 18GHz with <±0.5dB amplitude & <±2.5° phase imbalance. Cascaded balun + ADC measurements demonstrate no linearity limitation, while allowing for 19.5dB lower input signal. Occupying 1mm2in a 130nm BiCMOS process, the device consumes 100mA from 5V in a 2×2mm2 flip chip QFN package.