电迁移失败是否为对数正态分布?

28th Annual Proceedings on Reliability Physics Symposium Pub Date : 1900-01-01 DOI:10.1109/RELPHY.1990.66070

J. Towner

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引用次数: 1

摘要

讨论了在各种铝合金薄膜上进行的电迁移寿命试验，以研究失效分布的形式。样本大小从35到120不等，允许勘探接近1%的失败水平。结果表明，当晶粒尺寸小于线宽时，符合对数正态分布，而不是对数极值分布。然而，当颗粒超过线宽时，任何一种分布都可以用来表示数据。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Are electromigration failures lognormally distributed?

Electromigration lifetests performed on a variety of Al alloy films to study the form of the failure distribution are discussed. Sample sizes ranged from 35 to 120, allowing exploration near the 1% failure level. Results show that the lognormal rather than the logarithmic extreme value distribution holds where the grain size is smaller than the linewidth. Where the grain exceeds the linewidth, however, either distribution can be used to represent the data.<>

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28th Annual Proceedings on Reliability Physics Symposium

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