Co和Ni盐化工艺泄漏机理的比较研究

K. Goto, J. Watanabe, T. Sukegawa, A. Fushida, T. Sakuma, T. Sugii
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引用次数: 7

摘要

我们研究了Co和Ni盐化过程的泄漏机理。对结漏的统计分析和对Co和Ni盐化结漏点的直接光观察表明,与Co盐化结的漏点一样,Ni盐化结也显示出许多局部的引起泄漏的斑点,但在Ni盐化结中,这些斑点沿着LOCOS边缘。采用一种同时考虑区域和周边依赖性的新型尖峰泄漏模型,成功地模拟了泄漏电流。为了解释随后的结果,我们提出了一个应力诱导的穗生长模型。从这个模型出发,我们开发了一种使用Ge预非晶化步骤的无尖峰泄漏的Co盐化工艺。
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A comparative study of leakage mechanism of Co and Ni salicide processes
We investigated the leakage mechanisms of both Co and Ni salicide processes. Statistical analyses of the junction leakage and a direct light observation of the leakage points from Co and Ni salicided junctions revealed that Ni salicide also shows many localized spots that cause leakage just like those in the Co salicide case, but in the Ni salicide case, the spots are along the LOCOS edge. Leakage currents were successfully simulated by means of a new spike-leakage model that considers both area and peripheral dependent spike leakage. To explain the subsequent results, we proposed a stress induced spike growth model. Working from this model, we developed a spike-leakage-free Co salicide process using a Ge pre-amorphization step.
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