{"title":"硅集成电子-光子集成电路","authors":"P. Lo, D. Kwong","doi":"10.1109/OMEMS.2010.5672189","DOIUrl":null,"url":null,"abstract":"Copper interconnect is unlikely to be the ultimate solution to support the growing functionalities of next generation microprocessor due to its information latency and power consumption. Converging EPIC on a single chip platform to enable functional diversification emerges as one promising approach to be realized by taking the advantage of low energy and huge data capacity of optical interconnects. In this presentation, we present an overview on the current status of this critical technology development and provide an outlook and strategies for the integration of Si micro- and nano-photonics to meet the bandwidth and energy requirements of data communication in future technology nodes.","PeriodicalId":421895,"journal":{"name":"2010 International Conference on Optical MEMS and Nanophotonics","volume":"170 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-12-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Silicon integrated electronic-photonic ICs\",\"authors\":\"P. Lo, D. Kwong\",\"doi\":\"10.1109/OMEMS.2010.5672189\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Copper interconnect is unlikely to be the ultimate solution to support the growing functionalities of next generation microprocessor due to its information latency and power consumption. Converging EPIC on a single chip platform to enable functional diversification emerges as one promising approach to be realized by taking the advantage of low energy and huge data capacity of optical interconnects. In this presentation, we present an overview on the current status of this critical technology development and provide an outlook and strategies for the integration of Si micro- and nano-photonics to meet the bandwidth and energy requirements of data communication in future technology nodes.\",\"PeriodicalId\":421895,\"journal\":{\"name\":\"2010 International Conference on Optical MEMS and Nanophotonics\",\"volume\":\"170 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-12-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 International Conference on Optical MEMS and Nanophotonics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/OMEMS.2010.5672189\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 International Conference on Optical MEMS and Nanophotonics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/OMEMS.2010.5672189","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Copper interconnect is unlikely to be the ultimate solution to support the growing functionalities of next generation microprocessor due to its information latency and power consumption. Converging EPIC on a single chip platform to enable functional diversification emerges as one promising approach to be realized by taking the advantage of low energy and huge data capacity of optical interconnects. In this presentation, we present an overview on the current status of this critical technology development and provide an outlook and strategies for the integration of Si micro- and nano-photonics to meet the bandwidth and energy requirements of data communication in future technology nodes.