富锗GexSe1−x材料的电子结构、热性能和传导缺陷的原子研究

S. Clima, B. Govoreanu, K. Opsomer, A. Velea, N. S. Avasarala, W. Devulder, I. Shlyakhov, G. Donadio, T. Witters, S. Kundu, L. Goux, V. Afanasiev, G. Kar, G. Pourtois
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引用次数: 17

摘要

我们使用全层厚度(5nm)非晶模型在原子水平上研究了GexSe1−x材料的电子结构和缺陷。在富含Ge的GexSe1−x中,迁移空位缺陷的性质主要与Ge失配有关。迁移间隙态的居群/局域化仅在电场作用下发生变化。材料中N掺杂引入的强共价键提高了材料的导热性,结晶温度超过600℃。发现C/N掺杂剂可以增加/消除掺杂体系中的迁移率间隙态。我们的研究为材料设计提供了指导方针,以提高电热器件的性能。
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Atomistic investigation of the electronic structure, thermal properties and conduction defects in Ge-rich GexSe1−x materials for selector applications
We investigate the electronic structure and defects of GexSe1−x materials at the atomic level, using full-layer-thickness (5nm) amorphous models. In Ge-rich GexSe1−x, the nature of the mobility gap defects is mostly related to miscoordinated Ge. The population/localization of mobility-gap states changes solely under the effect of electric field. Strong covalent bonds introduced by N doping in the material increase its thermal conductivity and crystallization temperature beyond 600C. C/N dopants are found to add/remove mobility-gap states in the doped systems. Our investigation sets guidelines for material design in view of improved electro-thermal device performance.
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