基于NAND/NOR读出链的14nm组合逻辑电路软错误率测试结构

Saurabh Kumar, M. Cho, L. Everson, Hoonki Kim, Qianying Tang, Paul R. Mazanec, P. Meinerzhagen, Andres F. Malavasi, D. Lake, Carlos Tokunaga, M. Khellah, J. Tschanz, S. Borkar, V. De, C. Kim
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引用次数: 5

摘要

本文介绍了一种采用新型NAND/NOR读出链的14nm测试芯片,用于表征组合逻辑门的软错误率。所提出的测试结构使用高密度标准逻辑门作为检测电路,用于检测单事件瞬态(SET),然后将其转发到倾斜的NAND-NOR读出链,该读出链引导所有SET脉冲,同时扩大脉冲宽度以确保它们到达最终的三模冗余(TMR)计数器。所提出的电路紧凑,具有基于单元布局的可扩展架构,并且产生最小的面积开销。在14nm测试芯片上实现不同的栅极配置(器件尺寸、阈值电压、扇出和链长),并在中子束照射下收集大量的统计数据。辐射数据首次捕获了14nm三栅极技术中各种电路参数对组合逻辑SER的影响。
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An ultra-dense irradiation test structure with a NAND/NOR readout chain for characterizing soft error rates of 14nm combinational logic circuits
This paper describes a 14nm test chip employing a novel NAND/NOR readout chain for characterizing soft error rate (SER) in combinational logic gates. The proposed test structure uses high density standard logic gates as detection circuit for sensing Single Event Transients (SETs) that are then forwarded to a skewed NAND-NOR readout chain which funnels all SET pulses while expanding the pulse width to ensure they reach the final triple modular redundant (TMR) counter. The proposed circuit is compact, has a scalable architecture based on a unit cell layout, and incurs minimal area overhead. Different gate configurations (device size, threshold voltage, fan-out and chain length) were implemented in the 14nm test-chip and irradiated under a neutron beam to collect a massive amount of statistical data. Radiation data captures, for the first time, the impact of various circuit parameters on combinational logic SER in 14nm tri-gate technology.
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