一种新的自对准HBTs选择性SiGe外延生长技术

F. Sato, T. Hashimoto, T. Tashiro, T. Tatsumi, M. Hiroi, T. Niino
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引用次数: 9

摘要

介绍了一种在冷壁超高真空(UHV)/CVD条件下采用Si/sub 2/H/sub 6/+GeH/sub 4/+Cl/sub 2/选择性外延生长(SEG)技术。利用该技术,实现了具有选择性外延基底的自对准SiGe HBT。该技术还可以在具有悬垂结构的多晶硅下的硅上以及开放区域上无空隙选择性生长SiGe/Si外延层。在晶体管特性方面,得到了h/sub FE/为100,BV/sub CEO/为5.0 V。
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A novel selective SiGe epitaxial growth technology for self-aligned HBTs
A selective epitaxial growth (SEG) technology using Si/sub 2/H/sub 6/+GeH/sub 4/+Cl/sub 2/ under cold-wall ultra-high-vacuum (UHV)/CVD conditions is described. By using this technology, a self-aligned SiGe HBT with selective epitaxial base is realized. This technology also makes possible the void-free selective growth of SiGe/Si epitaxial layers on Si under polysilicon with overhanging structure, as well as on the open region. As for the transistor characteristics, h/sub FE/ of 100 and BV/sub CEO/ of 5.0 V were obtained.<>
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