{"title":"层状和涂层导体电阻和电感行为的建模","authors":"T. Demeester, D. De Zutter","doi":"10.1109/EPEP.2007.4387166","DOIUrl":null,"url":null,"abstract":"On-chip conductors have a finite thickness and are often composed of different metals. An efficient method to model the broadband resistive and inductive behaviour of such conductors is derived and applied to a few illustrative configurations.","PeriodicalId":402571,"journal":{"name":"2007 IEEE Electrical Performance of Electronic Packaging","volume":"55 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Modeling of the Resistive and Inductive Behaviour of Layered and Coated Conductors\",\"authors\":\"T. Demeester, D. De Zutter\",\"doi\":\"10.1109/EPEP.2007.4387166\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"On-chip conductors have a finite thickness and are often composed of different metals. An efficient method to model the broadband resistive and inductive behaviour of such conductors is derived and applied to a few illustrative configurations.\",\"PeriodicalId\":402571,\"journal\":{\"name\":\"2007 IEEE Electrical Performance of Electronic Packaging\",\"volume\":\"55 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-11-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 IEEE Electrical Performance of Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2007.4387166\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 IEEE Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2007.4387166","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Modeling of the Resistive and Inductive Behaviour of Layered and Coated Conductors
On-chip conductors have a finite thickness and are often composed of different metals. An efficient method to model the broadband resistive and inductive behaviour of such conductors is derived and applied to a few illustrative configurations.
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