单芯片和多芯片封装技术的两用微电子制造规范

M. Gorniak, D.F. Fayette, J. P. Farrell
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引用次数: 1

摘要

系统和设备的可靠性对客户满意度和系统可支持性都至关重要。随着技术的发展,如果不了解其对可靠性的影响,就不能将其插入新系统。支持新技术插入的规范和标准必须具有成本效益,实用性和可接受的供应商和用户,同时确保质量和可靠性。本文描述了采用最佳商业实践开发工业微电子制造规范的新举措的策略和现状,用于硅(Si),砷化镓(GaAs)和混合微电路以及多芯片模块(mcm),包括片上芯片(COB),密封或塑料包装。其目的是建立一个国家(ANSI)规范,具有世界范围内的接受类似于is9000 l,并被国防部,NASA和商业行业(即,汽车,电信,医疗,计算机)使用。
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Dual-use Microelectronics Manufacturing Specification for Single and Multichip Packaging Technologies
The reliability of systems and equipment is critical for both customer satisfaction and system supportability. As a technology evolves, it cannot be inserted into new systems without knowledge of the implication it has on reliability. Specifications and standards which support the insertion of new technology must be cost effective, practical and acceptable to vendors and users while assuring quality and reliability. This paper describes the strategy and status of a new initiative to develop an industry microelectronic manufacturing specification, using best commercial practices, for silicon (Si), gallium arsenide (GaAs) and hybrid microcircuits as well as multichip modules (MCMs), including chip-on-board (COB), in hermetic or plastic packaging. The intent is to establish a national (ANSI) specification that has worldwide acceptance similar to that of I S 0 9000 l , and is used by the DoD, NASA and commercial industries (i.e., automotive, telecommunications, medical, computer).
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