A. Wiatrowska, K. Fiączyk, P. Kowalczewski, M. Łysień, Łukasz Witczak, Jolanta Gadzalińska, Ludovic Schneider, Łukasz Kosior, F. Granek
{"title":"在复杂基底上沉积微米尺寸特征以进行非均相集成","authors":"A. Wiatrowska, K. Fiączyk, P. Kowalczewski, M. Łysień, Łukasz Witczak, Jolanta Gadzalińska, Ludovic Schneider, Łukasz Kosior, F. Granek","doi":"10.1109/fleps53764.2022.9781595","DOIUrl":null,"url":null,"abstract":"We demonstrate a novel Ultra-Precise Deposition (UPD) technology for heterogeneous integration in advanced packaging and printing interconnections on flexible substrates. UPD allows maskless deposition of highly-concentrated pastes on complex substrates. The printing resolution is in the range from 1 to 10 µm. The ink viscosity is up to 2,500,000 cP, which corresponds to 85% wt. of metal content and the electrical conductivity of printed structures is up to 45% of the bulk value. This technology is designed for rapid prototyping and manufacturing of next-generation printed and flexible electronics devices, including sensors, integrated circuits, displays, and energy harvesting systems.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"80 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Depositon of Micrometer-Size Features on Complex Substrates for Heterogeneous Integration\",\"authors\":\"A. Wiatrowska, K. Fiączyk, P. Kowalczewski, M. Łysień, Łukasz Witczak, Jolanta Gadzalińska, Ludovic Schneider, Łukasz Kosior, F. Granek\",\"doi\":\"10.1109/fleps53764.2022.9781595\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We demonstrate a novel Ultra-Precise Deposition (UPD) technology for heterogeneous integration in advanced packaging and printing interconnections on flexible substrates. UPD allows maskless deposition of highly-concentrated pastes on complex substrates. The printing resolution is in the range from 1 to 10 µm. The ink viscosity is up to 2,500,000 cP, which corresponds to 85% wt. of metal content and the electrical conductivity of printed structures is up to 45% of the bulk value. This technology is designed for rapid prototyping and manufacturing of next-generation printed and flexible electronics devices, including sensors, integrated circuits, displays, and energy harvesting systems.\",\"PeriodicalId\":221424,\"journal\":{\"name\":\"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)\",\"volume\":\"80 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-07-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/fleps53764.2022.9781595\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/fleps53764.2022.9781595","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Depositon of Micrometer-Size Features on Complex Substrates for Heterogeneous Integration
We demonstrate a novel Ultra-Precise Deposition (UPD) technology for heterogeneous integration in advanced packaging and printing interconnections on flexible substrates. UPD allows maskless deposition of highly-concentrated pastes on complex substrates. The printing resolution is in the range from 1 to 10 µm. The ink viscosity is up to 2,500,000 cP, which corresponds to 85% wt. of metal content and the electrical conductivity of printed structures is up to 45% of the bulk value. This technology is designed for rapid prototyping and manufacturing of next-generation printed and flexible electronics devices, including sensors, integrated circuits, displays, and energy harvesting systems.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
