低供电电压操作SRAM与HCI修整感测放大器

A. Kawasumi, Y. Takeyama, O. Hirabayashi, K. Kushida, Y. Fujimura, T. Yabe
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引用次数: 6

摘要

本文提出了一种利用小偏置电压(Vos)感测放大器(SA)的新方案,以减少在低电源下读取速度和电池稳定性的恶化。引入这一概念是为了实现具有小面积惩罚的低电源电压操作SRAM。热载流子注入(HCI)[1]引起的晶体管阈值电压(Vth)移位用于芯片制造后的Vos修整。在40nm CMOS工艺上实现了带有偏置修整电路的SA,通过测量和仿真结果证实了Vos降低了76mV。这种降低对应于在0.6V电源电压下读取频率提高40%和故障率提高8倍。
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A low supply voltage operation SRAM with HCI trimmed sense amplifiers
This paper proposes a new scheme utilizing a small offset voltage (Vos) sense amplifier (SA) to reduce the deterioration of the read speed and the cell stability at the low power supply. This concept is introduced to realize a low supply voltage operation SRAM with a small area penalty. The transistor threshold voltage (Vth) shift caused by Hot Carrier Injection (HCI) [1] is used for Vos trimming after the chip fabrication. The SA with the offset trimming circuit is implemented in 40nm CMOS technology and the reduction of Vos by 76mV has been confirmed with the measurement and simulation results. This reduction corresponds to the improvement of read frequency by 40% and 8x failure rate improvements at 0.6V supply voltage.
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