一种用树脂片封装半导体器件的新方法

1997 Proceedings 47th Electronic Components and Technology Conference Pub Date : 1997-05-18 DOI:10.1109/ECTC.1997.606145

H. Ota, S. Fujieda, T. Okuyama

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摘要

本文介绍了一种新的树脂片封装方法。开发这种方法有三个要点。1. 新型成型工艺及封装模具。2. 适用于本方法的树脂。3.树脂状态测定方法。该方法适用于制作薄封装。这些薄型包装模型在高压锅试验和热循环试验中具有较高的可靠性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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A new encapsulating method for semiconductor devices using resin sheets

This paper describes a new encapsulating method using resin sheets. There are three important points to develop this method. 1. New molding process and encapsulating molds. 2. Resin suitable for this method. 3. Measuring method for resin state. This method is suitable for fabricating thin packages. These thin model packages showed the high reliability of pressure cooker test and thermal cycle test.

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1997 Proceedings 47th Electronic Components and Technology Conference

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