A. Schiffmacher, D. Strahringer, Shreyas Malasani, J. Wilde, Carsten Kempiak, A. Lindemann
{"title":"电力电子模块寿命试验中的原位劣化监测方法","authors":"A. Schiffmacher, D. Strahringer, Shreyas Malasani, J. Wilde, Carsten Kempiak, A. Lindemann","doi":"10.1109/ECTC32696.2021.00149","DOIUrl":null,"url":null,"abstract":"Within the scope of this work three in-situ degradation monitoring methods are presented. The methods are suitable for the detection of degradations in power electronic modules during active power cycling test without interrupting the test itself. A comparison of the results is illustrated by conducting all three techniques during the lifetime testing of a power electronic module at the same time. In sum, electrical, electrothermal, thermal and thermomechanical parameters were evaluated. From the observations, we conclude that the primary failure mechanism of a novel die-top interconnect technology for power modules is the crack propagation in the Al-metallisation of the semiconductor. Cross-sectional images of the samples were prepared to confirm the previously given evidence of the failure. Furthermore a lifetime model was established for this assembly technology. Finally, a comparison of the advantages and limitations of the conducted degradation monitoring techniques will be presented.","PeriodicalId":351817,"journal":{"name":"2021 IEEE 71st Electronic Components and Technology Conference (ECTC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2021-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"In Situ Degradation Monitoring Methods during Lifetime Testing of Power Electronic Modules\",\"authors\":\"A. Schiffmacher, D. Strahringer, Shreyas Malasani, J. Wilde, Carsten Kempiak, A. Lindemann\",\"doi\":\"10.1109/ECTC32696.2021.00149\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Within the scope of this work three in-situ degradation monitoring methods are presented. The methods are suitable for the detection of degradations in power electronic modules during active power cycling test without interrupting the test itself. A comparison of the results is illustrated by conducting all three techniques during the lifetime testing of a power electronic module at the same time. In sum, electrical, electrothermal, thermal and thermomechanical parameters were evaluated. From the observations, we conclude that the primary failure mechanism of a novel die-top interconnect technology for power modules is the crack propagation in the Al-metallisation of the semiconductor. Cross-sectional images of the samples were prepared to confirm the previously given evidence of the failure. Furthermore a lifetime model was established for this assembly technology. Finally, a comparison of the advantages and limitations of the conducted degradation monitoring techniques will be presented.\",\"PeriodicalId\":351817,\"journal\":{\"name\":\"2021 IEEE 71st Electronic Components and Technology Conference (ECTC)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 IEEE 71st Electronic Components and Technology Conference (ECTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC32696.2021.00149\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE 71st Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC32696.2021.00149","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
In Situ Degradation Monitoring Methods during Lifetime Testing of Power Electronic Modules
Within the scope of this work three in-situ degradation monitoring methods are presented. The methods are suitable for the detection of degradations in power electronic modules during active power cycling test without interrupting the test itself. A comparison of the results is illustrated by conducting all three techniques during the lifetime testing of a power electronic module at the same time. In sum, electrical, electrothermal, thermal and thermomechanical parameters were evaluated. From the observations, we conclude that the primary failure mechanism of a novel die-top interconnect technology for power modules is the crack propagation in the Al-metallisation of the semiconductor. Cross-sectional images of the samples were prepared to confirm the previously given evidence of the failure. Furthermore a lifetime model was established for this assembly technology. Finally, a comparison of the advantages and limitations of the conducted degradation monitoring techniques will be presented.