Amit K. Tiwari, S. Perkin, N. Lophitis, Marina Antoniou, T. Trajkovic, F. Udrea
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引用次数: 4
摘要
研究了由优化的逆行p井组成的超高压(>10kV) SiC igbt的鲁棒性。在广泛的TCAD模拟中,我们表明,除了提供对阈值电压的鲁棒控制和消除穿孔外,逆行在减少超高压SiC igbt栅极氧化物上的应力方面非常有效。我们表明,与由传统p阱组成的对应物相比,由逆行p阱组成的10 kV SiC IGBT在栅极氧化物中显示出大大降低的峰值电场。采用优化后的深度为1 μ m的逆行p井,10kV额定SiC IGBT栅极氧化物中的峰值电场可降至2 MV以下。Cm−1,是实现高压电源器件高可靠性的前提条件。因此,我们提出逆行p井对于>10kV SiC igbt的开发具有很大的前景。
On the robustness of ultra-high voltage 4H-SiC IGBTs with an optimized retrograde p-well
The robustness of ultra-high voltage (>10kV) SiC IGBTs comprising of an optimized retrograde p-well is investigated. Under extensive TCAD simulations, we show that in addition to offering a robust control on threshold voltage and eliminating punch-through, the retrograde is highly effective in terms of reducing the stress on the gate oxide of ultra-high voltage SiC IGBTs. We show that a 10 kV SiC IGBT comprising of the retrograde p-well exhibits a much-reduced peak electric field in the gate oxide when compared with the counterpart comprising of a conventional p-well. Using an optimized retrograde p-well with depth as shallow as 1 µm, the peak electric field in the gate oxide of a 10kV rated SiC IGBT can be reduced to below 2 MV.cm−1, a prerequisite to achieve a high-degree of reliability in high-voltage power devices. We therefore propose that the retrograde p-well is highly promising for the development of>10kV SiC IGBTs.