{"title":"利用热瞬态结果计算的模型数据确定热应力的严重程度","authors":"Z. Sárkány, M. Rencz","doi":"10.1109/DTIP.2014.7056701","DOIUrl":null,"url":null,"abstract":"In this article a method is presented for the calculation of structural and thermal parameters from thermal transient measurement results in order to be used as input data for thermal stress simulation. It is shown how the geometry of the internal structure of the package and the temperature distribution can be approximated from the thermal response function measured after switching on a heating element in the package.","PeriodicalId":268119,"journal":{"name":"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Determination of the severity of thermal stress using model data calculated from thermal transient results\",\"authors\":\"Z. Sárkány, M. Rencz\",\"doi\":\"10.1109/DTIP.2014.7056701\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this article a method is presented for the calculation of structural and thermal parameters from thermal transient measurement results in order to be used as input data for thermal stress simulation. It is shown how the geometry of the internal structure of the package and the temperature distribution can be approximated from the thermal response function measured after switching on a heating element in the package.\",\"PeriodicalId\":268119,\"journal\":{\"name\":\"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)\",\"volume\":\"18 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/DTIP.2014.7056701\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DTIP.2014.7056701","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Determination of the severity of thermal stress using model data calculated from thermal transient results
In this article a method is presented for the calculation of structural and thermal parameters from thermal transient measurement results in order to be used as input data for thermal stress simulation. It is shown how the geometry of the internal structure of the package and the temperature distribution can be approximated from the thermal response function measured after switching on a heating element in the package.
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