高速硅光台上10gbps激光二极管的封装设计与测量

Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) Pub Date : 2003-12-08 DOI:10.1109/EPEP.2003.1250001

C. Schuster, D. Kuchta, E. Colgan, G. Cohen, J. Trewhella

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引用次数: 15

摘要

本文介绍了基于硅光台的10gbps激光二极管的电气封装设计。具体来说，讨论了宽带阻抗匹配问题。模拟数据将与测量数据进行比较。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Package design and measurement of 10 Gbps laser diode on high-speed silicon optical bench

In this paper the electrical package design for a 10 Gbps laser diode on a silicon optical bench will be presented. Specifically the wideband impedance matching is addressed. Simulated data will be compared to measurements.

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Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)

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