{"title":"研究微光学快门的热响应","authors":"C.C. Wong, S. Graham","doi":"10.1109/ITHERM.2002.1012576","DOIUrl":null,"url":null,"abstract":"This paper discusses the thermal analysis of a fully integrated micro-switch for surety applications. Specifically, this study focuses on the temperature increase of a micromachined optical shutter with spot heating from a micro-laser. To analyze the shutter response, a 'Design-to-Analysis' interface has been built that generates an accurate 3-D solid geometry from the 2-D mask layout. Besides performing analysis, engineers can also use this solid modeler to virtually prototype and verify a design before fabrication. A parametric study is performed to determine the effects of thermal conductivity and contact resistance on the thermal response of this passively cooled device.","PeriodicalId":299933,"journal":{"name":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","volume":"44 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"12","resultStr":"{\"title\":\"Investigating the thermal response of a micro-optical shutter\",\"authors\":\"C.C. Wong, S. Graham\",\"doi\":\"10.1109/ITHERM.2002.1012576\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper discusses the thermal analysis of a fully integrated micro-switch for surety applications. Specifically, this study focuses on the temperature increase of a micromachined optical shutter with spot heating from a micro-laser. To analyze the shutter response, a 'Design-to-Analysis' interface has been built that generates an accurate 3-D solid geometry from the 2-D mask layout. Besides performing analysis, engineers can also use this solid modeler to virtually prototype and verify a design before fabrication. A parametric study is performed to determine the effects of thermal conductivity and contact resistance on the thermal response of this passively cooled device.\",\"PeriodicalId\":299933,\"journal\":{\"name\":\"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)\",\"volume\":\"44 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-08-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"12\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ITHERM.2002.1012576\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITHERM.2002.1012576","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Investigating the thermal response of a micro-optical shutter
This paper discusses the thermal analysis of a fully integrated micro-switch for surety applications. Specifically, this study focuses on the temperature increase of a micromachined optical shutter with spot heating from a micro-laser. To analyze the shutter response, a 'Design-to-Analysis' interface has been built that generates an accurate 3-D solid geometry from the 2-D mask layout. Besides performing analysis, engineers can also use this solid modeler to virtually prototype and verify a design before fabrication. A parametric study is performed to determine the effects of thermal conductivity and contact resistance on the thermal response of this passively cooled device.
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